具有散热件的集成电路封装系统及其制造方法

Integrated Circuit Packaging System With Heat Spreader And Method Of Manufacture Thereof

Abstract

一种集成电路封装系统及其制造方法,所述系统包括:衬底;形成在所述衬底上的模盖;在所述模盖中刻划的基准标记;被施加在所述衬底上并且参照所述基准标记的热界面材料;以及安装在所述热界面材料上的散热件,所述散热件通过相对于所述基准标记对齐的定位缺口被准确地定位。
An integrated circuit packaging system, and method of manufacture therefor, includes: a substrate; a mold cap formed on the substrate; fiducial mark inscribed in the mold cap; a thermal interface material applied over the substrate and referenced by the fiducial mark; and a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.

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Patent Citations (3)

    Publication numberPublication dateAssigneeTitle
    CN-1799141-AJuly 05, 2006霍尼韦尔国际公司集成的散热器盖
    US-8994048-B2March 31, 2015Stats Chippac, Ltd.Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration
    US-9142481-B2September 22, 2015Stats Chippac Ltd.Integrated circuit packaging system with heatsink cap and method of manufacture thereof

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