一种功率器件模块封装用陶瓷基板的金属化方法

Metallization method of power device module encapsulation-used ceramic substrate

Abstract

本发明公开了一种功率器件模块封装用陶瓷基板的金属化方法,包括步骤:清洗待加工的陶瓷基板,除去该陶瓷基板表面的杂质和污垢;在陶瓷基板表面制作掩膜,该掩膜在激光辐照下会分解气化;激光直写电路,在陶瓷基板上形成电路层,利用激光在敷有掩膜的陶瓷基板上直接写出所需要的电路图形;镀金属膜层,在激光直写出电路的带掩膜陶瓷基板上镀金属膜层;除去掩膜,使在掩膜上形成的金属膜层与陶瓷基板相剥离;在电路层上镀金属加厚层;在金属加厚层上镀金属保护层,完成陶瓷基板的金属化加工。本发明在敷有掩膜的陶瓷基板上通过激光直写出电路,精度高、速度快、可重复性好、且能够在非平面的立体陶瓷上实现,减小了工艺成本,并且更环保。
The invention discloses a metallization method of a power device module encapsulation-used ceramic substrate. The metallization method comprises the following steps that: a ceramic substrate to be processed is cleaned, and impurities and dirt on the surface of the ceramic substrate are removed; a mask is manufactured on the surface of the ceramic substrate, wherein the mask will not be decomposed and gasified under the irradiation of laser; a circuit layer is formed on the ceramic substrate, and the laser is utilized to directly write a required circuit pattern on the ceramic substrate coated with the mask, and therefore, a circuit can be directly written out by the laser; metal film layer plating is performed: the ceramic substrate with the mask, on which the laser directly writes out the circuit, is plated with a metal film layer; the mask is removed, so that the metal film layer formed on the mask can be stripped from the ceramic substrate; a metal thickening layer is plated on the circuit layer; and a metal protective layer is plated on the metal thickening layer, so that metallization processing of the ceramic substrate can be completed. According to the metallization method of the invention, the circuit can be directly written out on the ceramic substrate with the mask through the laser. The metallization method has the advantages of high precision, fast speed and high repeatability, and can be implemented on non-planar three-dimensional ceramic, and can assist in reducing process cost, and is more environmentally friendly.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (3)

    Publication numberPublication dateAssigneeTitle
    CN-101460014-AJune 17, 2009同欣电子工业股份有限公司基板的直接镀铜金属化制造工艺
    CN-103533764-AJanuary 22, 2014昆山联滔电子有限公司Manufacturing method for forming conductor line on non-conductive substrate
    JP-2005243991-ASeptember 08, 2005International Display Technology Kk, Hidemi Nawafune, インターナショナル ディスプレイ テクノロジー株式会社, 秀美 縄舟金属配線形成方法およびこの方法で形成された金属配線回路

NO-Patent Citations (0)

    Title

Cited By (2)

    Publication numberPublication dateAssigneeTitle
    CN-105376933-AMarch 02, 2016乐健科技(珠海)有限公司陶瓷基印刷电路板及其制作方法、led模组及其制作方法
    CN-105376933-BJanuary 19, 2018乐健科技(珠海)有限公司陶瓷基印刷电路板及其制作方法、led模组及其制作方法